Application of Electron Backscatter Diffraction to Calcite-Twinning Paleopiezometry

Crystallographic preferred orientations analysis of quartz crystals in Psammite using electron backscatter diffraction,western Ireland

The present study investigates the crystal preferred orientation (CPO) of quartz crystals in psammitic rocks to ascertain the deformationmechanism using electron backscatter diffraction (EBSD) on quartz crystals from north of the Renvyle-Bofin Slide (RBS) nearLetterfrack in western Ireland. Complete crystallographic orientations were determined for several thousand individual quartz crystalsin ...

Direct detection of electron backscatter diffraction patterns.

We report the first use of direct detection for recording electron backscatter diffraction patterns. We demonstrate the following advantages of direct detection: the resolution in the patterns is such that higher order features are visible; patterns can be recorded at beam energies below those at which conventional detectors usefully operate; high precision in cross-correlation based pattern sh...

Electron backscatter diffraction in materials characterization

Electron Back-Scatter Diffraction (EBSD) is a powerful technique that captures electron diffraction patterns from crystals, constituents of material. Captured patterns can then be used to determine grain morphology, crystallographic orientation and chemistry of present phases, which provide complete characterization of microstructure and strong correlation to both properties and performance of ...

Biomineral electron backscatter diffraction for palaeontology

Electron backscatter diffraction (EBSD) originated in materials science and has transferred to biomineral research providing insight into fossil and modern biominerals. An electron microscopy technique, EBSD requires a fine polished sample surface where the electron beam diffracts in the first few lattice layers, identifying mineral, polymorph and crystallographic orientation. The technique is ...

Electron Backscatter Diffraction: Application to Cu Interconnects in Top-View and Cross Section